Mechanic QC-20 BGA IC Glue Remover Liquid


Key Features and Specifications:

• Function: Softens and removes tough sealing/resinating glue from BGA IC chips and other electronic components during repair.

• Safety & Composition:

  • Environmentally Friendly: The formula is safe and environmentally friendly.

  • Benzene-Free: Does not contain any benzene coderivative substances, reducing health risks.

  • Non-Corrosive: Designed not to harm the circuit board, surrounding components, or copper foil circuits.

• Compatibility: Effectively loosens various types of adhesives, including epoxy, phenolics, acrylate, polyurethane, and organosilicon.

• Volume: Comes in a 20 ml container.

• Application Method:

  1. Apply the liquid to the BGA IC chip using absorbent cotton.

  2. Cover the area with a plastic film and wait for about 20 minutes.

  3. Gently remove the softened outer glue with tweezers.

  4. Heat the chip with a hot air tool (~300°C) to melt the bottom glue, and then carefully remove the chip.