Lanrui C4 Explosion Proof Gasket for Mid Layer Bonding in Apple / Android Phone Motherboard Repair

Features:

• Lanrui C4 Explosion-proof Gasket, Not afraid of strong compression, Explosion-proof tin, Anti-deformation

• Phosphor-copper material offers better electrical performance: The gasket is made of phosphor copper material, featuring low electrical loss,high electrical efficiency, excellent fatigue resistance stable operation and long-lasting performance without any compromise

• Small size, big impact: The "pillar"of precision electronic hardware,unafraid of intense compression, explosion-proof soldering, and deformation prevention

• High-quality phosphorus copper: Low conductive loss, high efficiency, fatigue resistance

• Product Usage: When the main board is deformed, the middle layer of the main board does not fit well. Pressing it will

• cause solder to burst out. By placing a spacer pad on top and then pressing again, it is less likely for the solder to burst out. It is used as an auxiliary for fitting

Simple operation:

• Implant the tin paste using the tin-coated steel mesh

• Place the gasket at the required position

• Melt the solder paste on the solder pad and fix the chip for immediate use

Package includes:

• 1 x Gasket