Mijing ZG-183 Nano Solder Paste For Motherboard Repairs and BGA Chip Reballing

Technical Overview & Properties

• Melting Point: Settles precisely at 183°C, making it the standard industry sweet spot for medium-temperature leaded/leaded-equivalent electronics repair workflows.

• Nano Formulation: Features ultra-fine nano-particle tin powder that promotes strong capillary wetting. This reduces common micro-soldering errors like component bridging, oxidation, and false joints.