Mechanic SU3 3S UV Curing Solder Mask For BGA and PCB Circuit Repair Green

Key Technical Specifications

• Curing Speed: Rapid 3-second (3S) instant drying under targeted UV exposure.

• Temperature Resistance: High-temperature threshold; does not soften or reflow after solidifying

• Texture Profile: Fluid paste that cures into a solid, scratch-resistant insulating barrier.

Primary Applications

• Jumper Wire Fixation: Locks down fragile motherboard jumper coils safely without pad detachment.

• Structural Reinforcement: Stabilizes structural areas such as type-C/tail plugs and damaged motherboard screw posts.

• PCB Layer Repair: Repairs peeling, chipped, or scratched original solder mask layers on logic boards.

• Trace Insulation: Safeguards enamelled or micro-soldered lines from external moisture and dust particles.