Mechanic SC840 CPU Chip Glue Remover For CPUs GPUs and IC chips
Key Features & Capabilities
Targeted Dissolution: Specifically engineered for underfill glue, resin residues, and thermal paste on mobile phone and laptop motherboards.
Component Safe: Its non-corrosive and non-conductive formula protects PCB layers, metal contacts, and sensitive silicon surfaces.
Professional Grade: Designed for precision rework tasks such as reballing, chip extraction, and board restoration.
Fast Acting: Typically softens standard adhesives within 1 to 3 minutes, though tougher glues may require up to 5 minutes.
Step-by-Step Usage Guide:
Locate Adhesive: Confirm the distribution of the glue under a microscope. Mark key areas where the bond is thickest.
Apply Liquid: Use a needle or cotton swab to slowly inject approximately 0.5ml to 1.0ml of liquid along the edge of the chip.
Softening Phase: Let it sit at room temperature for 3 minutes to allow for deep penetration.
Assisted Removal: Use a hot air gun (set between 80°C and 100°C) to assist the chemical reaction before lifting the chip with a vacuum suction pen.
Final Clean: Wipe the remaining residue from PCB pads with a dust-free cloth dipped in the solution, followed by an alcohol cotton pad.
