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SAM18 UV Mask Stencil For E8835P E8535P MT6789V BGA254 Solder Mask Repair

Key Applications

  • BGA Reballing: Used to precisely apply solder balls or paste to Ball Grid Array (BGA) chips, such as the Exynos 1330 (E8535P) and Exynos 1380 (E8835P) CPUs.

  • Solder Mask Repair: Facilitates the accurate application of UV-curable green oil (solder mask) to insulate and protect circuit areas that have been damaged or peeled during repair.

  • Component Alignment: Features detailed outlines and alignment markings to ensure perfect placement of ICs on intricate circuit boards.