SAM18 UV Mask Stencil For E8835P E8535P MT6789V BGA254 Solder Mask Repair
Key Applications
BGA Reballing: Used to precisely apply solder balls or paste to Ball Grid Array (BGA) chips, such as the Exynos 1330 (E8535P) and Exynos 1380 (E8835P) CPUs.
Solder Mask Repair: Facilitates the accurate application of UV-curable green oil (solder mask) to insulate and protect circuit areas that have been damaged or peeled during repair.
Component Alignment: Features detailed outlines and alignment markings to ensure perfect placement of ICs on intricate circuit boards.
