Mechanic ISM5 Jump Wire Specific Solder Tin Paste For PCB BGA Rework

Key Product Details:

• Application: Specifically designed for "fly line" or jump wire repair on mobile phone PCBs, including fingerprint line repair and fixing broken pads/tracks.

• Melting Point: The manufacturer specifies a melting temperature range of 220°C to 230°C.

• Features: Derived from a Japanese formulation using industrial-grade nano compounds, it offers high activity and excellent wettability. It ensures strong, stable, and conductive solder joints with minimal residue or spattering during heating.

• Consistency: The paste has a smooth, moderate viscosity, allowing for controlled application in small, dense PCB areas.

• Packaging: It comes in a 3ML syringe package, often including two or three precision applicator needle tips for easy and precise use.