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2UUL JOINT X Solder PPD Paste for Repair 158*C/ 183*C/ 200*C For Mobile Phone Repair

  • FS158 (Low Temp - 158°C): Designed for heat-sensitive components and mid-layer soldering, reducing the risk of board warping or component damage during reflow.

  • FS183 (Standard Temp - 183°C): A versatile "eutectic" paste suitable for standard PCB repairs and small-to-medium-sized chip soldering.

  • FS200 (High Temp - 200°C): Formulated for high-temperature sensitive components like CPUs that require higher thermal stability and durable joints. 

Key Performance Features

  • High Wettability: Ensures smooth solder flow, resulting in clean, shiny, and reliable electrical connections.

  • Consistent Texture: The smooth paste is optimized for precision application through stencils or syringes without splashing or clumping during heating.

  • Low Residue Formulation: A "no-clean" formula that leaves minimal waste after soldering, significantly reducing post-repair cleanup time.

  • Oxidation Resistance: Contains high-quality flux that prevents oxidation, ensuring the longevity and conductivity of the solder joints.