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2UUL BH17 CPU Reball Base Magnetic Dual Sided BGA Reballing Platform Set for iPhone / Android

Key Specifications & Components

  • Model: BH17 (Cpureball Base).

  • Structure: CNC-machined aluminum alloy body with a dual-sided magnetic frame for maximum stability.

  • Included Stencils: Typically comes with 75 precision CPU stencils covering a wide range of chipsets.

  • Stencil Thickness: Includes options for 0.12mm (some kits specify T0.6 for Apple and T0.35 for Android) to handle various reballing requirements.

  • Dimensions: Platform size is approximately 58 × 58 × 11 mm with a net weight of 238g. 

Features and Benefits

  • Magnetic Locking: Features a powerful dual-sided magnetic system that holds both the CPU and the stencil firmly in place, preventing shifting during heating.

  • High Compatibility: Supports a broad spectrum of mobile processors, including Apple A-series (A10 to A19), Qualcomm Snapdragon (up to SM8750/Snapdragon 8 Ultra), MediaTek (MTK), and Samsung Exynos.

  • Efficiency: The dual-sided design allows technicians to switch between different chip types quickly without losing alignment, increasing workflow throughput.

  • Thermal Contact: Engineered for improved thermal contact and heat resistance, ensuring the platform does not warp or lose magnetic strength during hot-air reflow. 

Usage Tips

  1. Preparation: Always place the platform on a flat, stable work surface.

  2. Alignment: Carefully align the CPU and the magnetic stencil before applying heat to ensure even solder ball distribution.

  3. Heat Management: Avoid excessive hot air pressure which can cause "stencil lift." Do not overheat the base excessively to preserve the life of the internal magnets.

  4. Maintenance: Clean stencils thoroughly after each use with a suitable solvent (like Relife RL-055 dispenser bottle) to maintain aperture accuracy.