High temperature Resistant Explosion Proof Solder Tin Gasket Glass

Key Features and Functions:

• Anti-Splatter Protection: It prevents the formation of uneven solder balls and "bursting" caused by pad oxidation or stencil protrusion during heating.

• High-Temperature Resistance: Made from ultra-clear, explosion-proof glass, it can withstand extreme heat without cracking, maintaining high thermal conductivity to ensure even heating of the chip.

• Stencil Stability: It solves the issue of steel reballing meshes bulging or deforming under heat, ensuring a flat surface for precise soldering.

• Clear Visibility: The transparent glass allows technicians to monitor the soldering process in real-time while protecting the surrounding workspace. 

Technical Specifications:

• Material: Impact-resistant and heat-resistant ultra-white glass.

• Durability: Designed to maintain its color and adhesion under high-temperature soldering conditions without peeling.