MaAnt Black Universal BGA Reballing Stencil For Mobile Phone Repair

Key Features and Specifications:

• Material: Made from 0.12mm thick, high-grade imported alloy steel, ensuring flexibility, strong toughness, and resistance to deformation at high temperatures.

• Design: Features a matte black anti-glare coating to minimize light reflection, which improves visibility and reduces eye strain during intricate work under a microscope. The holes are precise, laser-cut square-holed with rounded corners, designed to form round, full solder balls without jamming.

• Durability: Engineered to withstand high reflow temperatures, typically up to 105°C, without warping or damage, ensuring reliable performance and longevity.

• Universal Compatibility: This multi-functional tool supports a wide range of common mobile ICs and chipsets, including those for Apple (iPhone, iPad), Huawei, Samsung, Xiaomi, and more.