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Kingbo RMA-218 Flux Paste 100gm For Multipurpose Soldering Use

Key Features and Specifications:

  • No-Clean Formula: The flux leaves minimal, non-conductive, and non-corrosive residue, which often eliminates the need for post-soldering cleaning.

  • High Viscosity: The gel-like consistency ensures excellent adhesion, allowing it to stay in place during rework and BGA reballing processes, and helping solder balls "stick much more".

  • Enhanced Solder Flow: It improves the flow (wetting) of both leaded and lead-free solder, ensuring a strong intermetallic bond and reliable, high-quality solder joints.

  • Thermal Stability: The formula performs well under a working temperature range of approximately 180°C to 250°C without breaking down.

  • Wide Compatibility: It is suitable for various soldering tasks, including component soldering, desoldering, and fine-pitch applications. 

Applications:

The Kingbo RMA-218 is widely used for high-precision and demanding electronic repairs, including: 

  • BGA Rework and Reballing: Ideal for attaching spheres or pins to BGA, CGA, and CSP packages.

  • SMD Soldering and Repair: Excellent for surface mount device (SMD) components and fine-pitch IC and chip assembly.

  • Circuit Board Repair: A go-to solution for mobile phone, laptop, and general PCB (Printed Circuit Board) maintenance and repair.