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KAISI 220 PPD High Temperature Lead Free Solder Paste For Bga Reballing


Key Features and Specifications

  • Melting Point: The key characteristic is its high melting point of 220°C. This is higher than standard leaded solder pastes (which melt around 183°C), making it a lead-free option designed to meet modern environmental standards and the requirements of high-end device motherboards (e.g., Apple and Huawei).

  • Composition: It is a homogeneous mixture of high-purity alloy solder powder and soldering flux. The specific alloy composition is designed for strong welding force and good conductivity.

  • Application: Primarily used for surface mount technology (SMT) rework, BGA (Ball Grid Array) reballing, and precise component soldering on PCBs (Printed Circuit Boards). The paste consistency allows it to temporarily hold components in place before reflow.

  • Performance: The unique formula aims to provide perfect soldering performance with bright, full solder joints, no bubbling, and no false welding. The strong activity of the flux aids in tinning/climbing and prevents oxidation during heating.

  • Environmental: It is designed to be environmentally friendly and free from chemical pollution, adhering to lead-free requirements.