LANRUI 250ml CPU Nand Glue Remove Liquid For Phone Motherboard
Key features
Effective Formula: The liquid is designed to quickly soften and loosen solidified resin adhesives, making mechanical removal easier and more efficient.
Safety: It is non-corrosive and specifically formulated not to damage sensitive components or the chip's underlying primer, ensuring the integrity of the board during repair.
Low Odor: The optimized second-generation formula has a reduced, low odor, providing a safer and more comfortable working environment for technicians.
Efficiency: Soaking a component in the liquid can dissolve the glue in approximately 10 to 30 minutes, depending on the glue type and generation of the product.
Residue-Free: The solution is designed to leave no residue after the cleaning process, ensuring a clean surface for re-soldering or component placement.
Packaging: The 250ml bottle offers ample supply for multiple repair projects and features a sealed, leak-proof design to prevent evaporation.
How to use
Prepare: Use a soldering iron to remove any residual tin from the component (e.g., CPU) pads.
Immerse: Place the component or affected area of the PCB in an appropriate amount of the liquid and let it soak for about 10–30 minutes.
Clean: After soaking, use a stiff brush or a specialized CPU shovel to gently brush away the softened black glue.
Finish: Clean the area thoroughly with isopropyl alcohol or water if necessary.
