Relife HW4 High Precision PPD Solder Chip Repair Tinning Set For Mobile Phone

Key features

• 3-Temperature matching: The set is designed to work with various chip reballing needs by including tin paste with three different melting temperatures:

  • 138°C Low Temp: Ideal for working on sensitive chips and components to avoid heat damage.

  • 183°C Medium Temp: A universal temperature setting suitable for general reballing purposes.

  • 227°C High Temp: For applications requiring faster penetration and stronger soldering.

• Reballing scraper: A high-quality steel scraper is included for accurate reballing and to meet the needs of various angles and repair operations.

• Desoldering wire: A scientifically formulated desoldering wire is also included to assist in powerful and clean desoldering, resisting oxidation and corrosion.

• Targeted application: The HW4 set is specifically designed for use on mobile CPU chips, addressing common rework issues in smartphone motherboard repairs. 

Application in electronics repair :

The RELIFE HW4 is primarily used by professional mobile phone and electronics repair technicians for tasks involving micro-soldering, including:

• Chip reballing: Re-soldering ball grid array (BGA) chips, such as CPUs and memory, onto the motherboard after they have been removed.

• IC replacement: Removing and installing new integrated circuits with precise control over the soldering process.

• General motherboard repair: Cleaning and preparing soldering points for a variety of component-level repairs.

  Package includes:

  • 1 x Desoldering Wick

  • 1 x Reballing and Scraping Tool

  • 3 x Solder Paste