Relife HW11 Lead Free And Halogen Free Solder Flux For Mobile Phone Repair

Key Features and Specifications

• Composition: It is a lead-free and halogen-free formula, adhering to modern environmental standards and ensuring a safer work environment with minimal smoke and odor.

• Application: Ideal for intricate tasks such as:

  • CPU and chip desoldering and repair.

  • BGA (Ball Grid Array) tinning/soldering.

  • Precision welding of various electronic components.

  • Mobile phone motherboard repair.

• Performance:

  • Activity: It has a nano high-activity factor, which quickly removes the oxide film from surfaces, ensuring a strong, reliable bond and preventing cold soldering.

  • Fluidity: The paste is described as having good fluidity and high tackiness, allowing for accurate application on fine-pitch components and precise stencil printing without slumping or bleeding.

  • Residue: It is a "no-clean" formula, leaving minimal, non-conductive residue after soldering, which reduces post-cleaning time and the risk of short circuits.

  • Joint Quality: It promotes the formation of bright, full, and uniform solder joints.

• Packaging: It typically comes in a syringe with extra application tips for accurate dispensing, reducing waste and allowing for one-handed operation.

• Storage: The recommended storage temperature for optimal shelf life is typically 0–10°C (refrigerated).