2UUL PB02 PadBall Solder Balls for Android Solder Pad Rework - 100K

Features:

• Sn63/Pb37 Alloy: Reliable eutectic composition (183°C melting point) for smooth reflow and strong joints.

• Precision Sizing: Uniform diameters (0.2mm/0.3mm/0.45mm/0.6mm/0.76mm) for BGA/CSP pad restoration.

• High Purity: Low oxidation with minimal residue, reducing bridging risks.

• Bulk Quantity: 100K balls per bottle (30g net weight) for cost-effective repairs

• Each bottle contains 100,000 precision-sized solder beads (0.2~0.76mm) to meet demanding micro-soldering applications