More Details

Amaoe U-QSU6 CPU BGA Reballing Stencil for Qualcomm SM8750 SM8635 SM7635 SM6450 SM7435 SM8650 SM4450 SM7550

Compatible ICs

The U-QSU6 stencil is compatible with a range of Qualcomm processors, particularly those from the newer Snapdragon 7 and 8 series: 

  • SM8750 (Snapdragon 8 Gen 3)

  • SM8635

  • SM8650

  • SM7635

  • SM7550

  • SM6450

  • SM4450 

Key Features

  • Material: Crafted from high-quality, super-hard stainless steel (often Japanese steel) that is resistant to high temperatures and warping.

  • Precision Engineering: Features micro-aperture designs for perfect alignment with the BGA pads, ensuring uniform solder application and high success rates for repairs.

  • Durability: The stencil is reusable and designed for long-lasting performance in professional repair environments.

  • Thickness: Typically 0.12mm thick, which helps in controlled and consistent solder paste application