Amaoe U-IP11 CPU BGA Reballing Stencil for iPhone 15 Series Apple A16 / A17

• Designed for A16 / A17 CPU IC

• Supports iPhone 15 / 15 Plus / 15 Pro / 15 Pro Max

• Thickness ~0.12mm for accurate solder ball placement

• Essential for CPU reballing & advanced motherboard repair

👉 This is the most important stencil for chip-level technicians.