JTX T4 Pro Universal Chips Glue Removal and Tin Planting Platform Set for iPhone / Samsung / Hisilicon / Android RAM


Features:

• T4 Pro degumming and tin planting platform, support Apple/Huawei/OPPO/VIVO/Honor/Xiaomi/Samsung and other models a total of 84 models of chips

• The 2-in-1 design greatly helps the maintenance master to save costs and plant tin efficiency

• Magnetic automatic clamping, universal 3D planting tin net, removing the glue card, precise positioning

• Clamping precision, more stable operation, not easy to damage the chip

• Using a new type of magnetic dynamic positioning, strong magnetic clamping stable, automatic alignment

• It has wear-resistant, anti-slip, shock-absorbing, anti-aging, non-toxic tasteless, and high-temperature resistance

• Selected high-quality steel, fine workmanship, wear resistance, high toughness support tin planting

• Support unlimited expansion, a total of 76 types of chips

Supported models are as follows:

• Qualcomm: MSM8909/8905, MSM8916/8939, MSM8917, MSM8953, MSM8953 1AB, MSM8937/8940, MSM8996, SM8150, SM8250, SM8250-002, SM8350, SM8450, SM8475, SM8550, SM8650, SM6115, SM7225-00AB, SM7250, SM7325, SM7350, SDM439, SDM636, SDM710, SDM845, SM665, SM6150, SM8750, SM730G, SM7150,SM680, SM6225, SM7475, SM6450, SM720, SM7125

• Dimensity: MT6761V/6762V/6765V, MT6885Z, MT6895Z, MT6893Z, MT6855V, MT6853V, MT6877V, MT6769V, MT6873V, MT6833V, 1100/1200, 9200, 9300

• Android RAM: BGA 376, BGA 436, BGA 496, BGA 556

• Samsung Exynos: 990, 8895, 980, 2100, 2200, 9820

• Huawei Hisilicon: HI3660, HI9290/L, HI6280, HI3690 5G, HI3680, HI36A0, HI3670, HI36A0, HI6260, HI3690 4G

• Apple: A8, A9, A10, A11, A12, A13, A14, A15, A16, A17, A18, A18 Pro

Package includes:

• 1 x Fixture

• 14 x Stencil