2UUL BH04 MICRO JIG IC Mini Glass Fixture for Mobile Phone Motherboard Repair


Key Features and Specifications

• Material: Features a tempered, insulated glass work surface that is highly resistant to heat (up to 500°C) and easy to clean of welding oil and rosin.

• Secure Clamping: Employs a rotary fixed design and a unique force-bearing IC beam clamp to hold motherboards and chips firmly without movement or rebound during intense work, preventing damage to the IC.

• Adjustability: The fixture is adjustable to high, middle, and low levels by loosening bottom screws, accommodating PCBs and chips of various sizes and thicknesses.

• Heat Dissipation: Designed with a heat sink at the bottom and anti-skid pads that allow hot air to discharge more efficiently, protecting the components.

• Multi-Functionality: Ideal for a wide range of micro-soldering tasks, including:

  • General mobile phone motherboard repair.

  • Fixing large chips like CPU and NAND for cleaning and tin removal.

  • Protecting double-layer motherboards during separation and reassembly.

    
    Package includes:

• 1 x Fixture