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Amaoe UN:3 Unisoc T820 UMS9620S CPU General Series BGA Reballing Stencil for Skywing Patton S9
UMT9620 / UMP9620/ BGA254


Key features

  • High-quality stainless steel: The stencil is made from a durable, heat-resistant metal that can withstand the high temperatures involved in the reballing process.

  • Precision laser cut: The apertures, or holes, are precisely cut to match the solder pad layout of the compatible CPUs, ensuring accurate and clean solder paste application.

  • High durability: The high-grade construction allows for repeated use without warping or compromising precision.

  • Compatibility: This specific stencil is designed for certain Unisoc T820 and UMS9620S CPUs, making it an essential tool for technicians repairing devices that use these components. 

Uses and applications

  • BGA reballing: The stencil is used to precisely apply solder paste to the pads of the CPU after it has been removed from a circuit board. The reballed CPU can then be reinstalled.

  • Unisoc CPU repair: It is a key tool for technicians performing micro-soldering and motherboard-level repairs on devices, such as some Android smartphones, that use compatible Unisoc chips.