YCS R1 Pro 1000W Intelligent Hot Air Gun BGA Soldering Rework Station with 4 Nozzles For Mobile Phone CPU BGA Chip SMT Welding Repair
Key features
High power and rapid heating: A 1000W heating core ensures fast and accurate heating, suitable for both small and large solder joints.
Three heating modes: The station includes standard, programmable curve, and constant temperature modes, allowing for flexible and precise thermal control.
HD color screen: A high-resolution color screen displays dynamic power, real-time temperature, and other controls, giving the user an at-a-glance overview of the process.
Intelligent functions:
Auto-sleep mode: A sensor in the handle's holder automatically triggers a sleep mode when the tool is not in use, extending the life of the heating core.
Airflow modes: It offers both strong airflow for large chips and gentle airflow for delicate components.
Four nozzles included: The station comes with a standard set of four nozzles (5mm, 10mm, 12x17mm, and 13x13mm) for various applications.
Anti-static design: It is designed to be ESD-safe, protecting sensitive electronic components from damage caused by electrostatic discharge.
Additional armrest: The "Pro" version includes a removable armrest for enhanced comfort during long working sessions.
Applications
Mobile phone repair: Ideal for repairing and desoldering motherboards, CPUs, IC chips, and other delicate components.
BGA and SMD rework: Suitable for precision BGA reballing and SMD soldering tasks.
Laptop and tablet repair: Used for component-level repair on computer motherboards.
