RELIFE RL-407 Thermal Silicone Conductive Rapid Cooling Paste for Phone and Computer Repair

1. Applicable to IP/Android mobile phones, laptop, desktop computer CPU/graphics card processors, various modules with high thermal conductivity requirements, high-speed large storage drives, network communication equipment, cooling devices, electronic components, office software equipment, household appliances Waiting for the maintenance and use of various devices.

2. Thermal conductivity 6.0W/MK, heat and humidity resistance, environmental aging resistance, easily cope with the heat brought by high power consumption CPU/GPU.

3. Has good insulation, non-conductive, and does not corrode various heat dissipation components.

4. Low deformability, good plasticity, low fluidity, compressible voids.