YCS Desoldering Wick 2015 BGA Tin Suction Solder Wick


Key features

• Material: Made from high-quality braided copper wire for excellent thermal conductivity and strong tin absorption.

• Integrated flux: The wick is coated with rosin flux, which helps activate the wicking process and improves solder removal speed.

• Strong absorption: The woven design is optimized for strong capillary action, allowing it to quickly pull molten solder away from the soldering points.

• Low residue: Formulated to leave minimal residue, which simplifies the cleaning process after desoldering.

• Anti-oxidation and anti-corrosion: The copper material is resistant to oxidation and corrosion, ensuring long-term performance and durability.

Common applications

• Mobile phone repair: Used for delicate micro-soldering on mobile phone motherboards, where excess solder can cause short circuits.

• BGA and SMD rework: Effective for cleaning pads after removing BGA (Ball Grid Array) and SMD (Surface Mount Device) components.

• Removing excess solder: Used to remove solder bridges and other imperfections during general soldering tasks.

• IC removal: Helps clear solder from integrated circuit (IC) pins, making it easier to safely remove components from the PCB.