Amaoe S908U-012 0.12mm Middle Layer BGA Reballing Stencil for Samsung S22 Ultra SM-S908U / W / 0 / D / E

🔧 Key Details

• Model: S908U-012

• Compatibility:

  • Samsung Galaxy S22 Ultra (SM-S908U / W / 0 / D / E / B variants)

• Thickness: ~0.12mm (industry standard for precision)

• Material: High-quality stainless steel

• Design: High-precision cutouts for exact BGA pad alignment

👉 Designed specifically for perfect alignment with S22 Ultra motherboard layout, ensuring accurate solder ball placement

🔩 What It Is Used For

This stencil is used for:

• Middle layer (sandwich motherboard) reballing

• Fixing:

  • Dead phone (no power)

  • Heating / restart issues

  • Signal / baseband faults

• Rebuilding inter-layer solder connections

👉 Essential tool for advanced motherboard repair technicians


Package includes:

• 1 x Stencil