YCS 10CC Black Chip Sealing Glue UV Curing Waterproof Adhesive for Cell Phone CPU LCD IC Beautification Renovation Repair

Core Features & Specifications

• UV Curing Technology: Unlike standard air-dry glues, this adhesive requires a UV light source to cure, which allows for rapid, 3-second initial solidification and precise positioning before setting.

• Thermal Resistance: Engineered to withstand high operational temperatures (up to), ensuring the bond remains stable even under heavy CPU loads.

• Protective Barrier: Creates a waterproof, dustproof, and moisture-resistant seal that safeguards sensitive internal components like hard drives and motherboard chips.

• Flexible Consistency: The cured adhesive is anti-crack and slightly flexible, which prevents it from becoming brittle or damaging delicate components during thermal expansion.

• Syringe Packaging: Typically sold in a 10cc (approx. 22g) syringe kit that includes a plunger and a fine needle applicator for mess-free, pinpoint application.