Mechanical IX5 Ultra Universal Preheating Platform for Motherboard Planting Tin / Degumming
Features:
Mechanic IX 5 Ultra universal breakthrough preheating platform, no air gun, no soldering iron, uniform heating
Layering / Tinning / Laminating / Degumming, Compact & Lightweight
Uniform heating, no air gun, no solder iron, aluminum alloy panel, freely controlled temperature
Fit all sizes of cell phone motherboards, support motherboard delamination, lamination, dot matrix repair
Specification:
Name: Universal Preheating Platform
Gross Weight: 381.7g
Model: Breakthrough iX 5Ultra
Net Weight: 181.7g
Voltage 110V /220V
Product Size: 80*80*57.6mm
Package Size 182*150*55mm
Scope: Support motherboard delamination, lamination, and dot matrix repair
Preheating Temperature Range: 20~260°C
Package includes:
1 x Preheating Platform
1 x Power Cable