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Mechanical IX5 Ultra Universal Preheating Platform for Motherboard Planting Tin / Degumming

Features:

  • Mechanic IX 5 Ultra universal breakthrough preheating platform, no air gun, no soldering iron, uniform heating

  • Layering / Tinning / Laminating / Degumming, Compact & Lightweight

  • Uniform heating, no air gun, no solder iron, aluminum alloy panel, freely controlled temperature

  • Fit all sizes of cell phone motherboards, support motherboard delamination, lamination, dot matrix repair


Specification:

  • Name: Universal Preheating Platform

  • Gross Weight: 381.7g

  • Model: Breakthrough iX 5Ultra

  • Net Weight: 181.7g

  • Voltage 110V /220V

  • Product Size: 80*80*57.6mm

  • Package Size 182*150*55mm

  • Scope: Support motherboard delamination, lamination, and dot matrix repair

  • Preheating Temperature Range: 20~260°C


Package includes:

  • 1 x Preheating Platform

  • 1 x Power Cable