More Details

Amaoe M53 10cc Soldering Flux Paste For Electronics PCB IC Mobile Phone CPU BGA

Features and Specifications:

  • Formula: No-clean, lead-free, and halide-free formula designed to leave minimal, non-corrosive, and non-conductive residue.

  • Application: Ensures smooth solder flow, improves wetting properties, and enhances the strength and reliability of solder joints.

  • Design: Packaged in a 10cc syringe with a push rod and multiple needles for precise, controlled application, minimizing waste.

  • Versatility: Suitable for use with various solder alloys and effective on a wide range of surfaces, including those with light to moderate oxidation.

  • Safety: Environmentally friendly, produces no irritating odors, and has good insulation resistance to protect sensitive components.

  • Temperature Range: Operates consistently within a working temperature range of approximately 200°C to 480°C. 

Common Applications:

  • Smartphone Repair: Widely used in the mobile phone repair industry for intricate board-level repairs.

  • BGA Rework: Ideal for BGA (Ball Grid Array) reballing and SMT (Surface Mount Technology) soldering processes.

  • Component Soldering: Used for soldering and repairing CPUs, ICs, LEDs, and various other delicate electronic assemblies