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2uul 4-in-1 Hand Finish X Blades for Mobile Phone Screen Debonding / Removal IC

Features:

  • Double-sided uniform trimming, utility model patented technology

  • The blade is from thin to thick, and the force is more uniform

  • It is suitable for removing glue from the screen and removing the CPU, screen IC, mobile phone motherboard, small parts such as separators, chips, etc

  • Upgraded to a more practical bent-blade design, by bending the blade, the loss to the motherboard, chip, screen, etc is realized and reduced, thereby improving the yield

  • Nano-coating is anti-rust, the blade body is flexible, thin, and elastic, the thickness of the blade tip is equal to 0.06mm, and the thickness of the blade tail is about 0.3mm


Package includes:

  • 4 x Blades