Mechanic XG50 183*C 35G PPD Solder Paste For PCB BGA Repair Silver Tin Paste
Features:
No false soldering, no cleaning, fast tin climbing, a wide range of applications.
Bright and full solder joints, less residue, and various styles to choose from.
Applicable to engineering circuit repair, PCBA welding, SMT chip, mobile phone motherboard welding QFN, and other maintenance of a wide range of areas
Bright and full solder joints, high resistance, strong activity, easy to weld, not easy to appear false welding or false welding and other bad phenomena
The tin paste is sticky and smooth, the viscosity change is small, chip components are not easy to produce offset
Specification:
Brand: Mechanic
Melting point: 183℃
Volume: 35G
Model Number: XG50
Ingredients: Sn63% Pb37%
Package includes:
1 x Flux Soldering Paste