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Mechanic XG50 183*C 35G PPD Solder Paste For PCB BGA Repair Silver Tin Paste

Features:

  • No false soldering, no cleaning, fast tin climbing, a wide range of applications.

  • Bright and full solder joints, less residue, and various styles to choose from.

  • Applicable to engineering circuit repair, PCBA welding, SMT chip, mobile phone motherboard welding QFN, and other maintenance of a wide range of areas

  • Bright and full solder joints, high resistance, strong activity, easy to weld, not easy to appear false welding or false welding and other bad phenomena

  • The tin paste is sticky and smooth, the viscosity change is small, chip components are not easy to produce offset

  • Specification:

    • Brand: Mechanic

    • Melting point: 183℃ 

    • Volume: 35G

    • Model Number: XG50

    • Ingredients: Sn63% Pb37%

Package includes:

  • 1 x Flux Soldering Paste