Mechanic XG50 183*C 35G PPD Solder Paste For PCB BGA Repair Silver Tin Paste

Features:

• No false soldering, no cleaning, fast tin climbing, a wide range of applications.

• Bright and full solder joints, less residue, and various styles to choose from.

• Applicable to engineering circuit repair, PCBA welding, SMT chip, mobile phone motherboard welding QFN, and other maintenance of a wide range of areas

• Bright and full solder joints, high resistance, strong activity, easy to weld, not easy to appear false welding or false welding and other bad phenomena

• The tin paste is sticky and smooth, the viscosity change is small, chip components are not easy to produce offset

• Specification：

  • Brand: Mechanic

  • Melting point: 183℃ 

  • Volume: 35G

  • Model Number: XG50

  • Ingredients: Sn63% Pb37%

Package includes:

• 1 x Flux Soldering Paste