MaAnt 50g No-cleaning Lead-free Silver-containing Solder Paste for PCB Motherboard Repair

Key Features and Specifications

• Melting Point: The key feature is its ultra-low melting point of 138°C. This is significantly lower than standard lead-free solder (around 220°C) or traditional leaded solder (around 183°C), which helps minimize heat damage to sensitive components during rework.

• Composition: It is a lead-free paste that incorporates silver particles in its formula, designed to improve conductivity and enhance the strength of solder joints.

• Application: It is primarily used for intricate tasks such as:

  • BGA (Ball Grid Array) reballing and tin planting.

  • SMD (Surface Mount Device) component soldering.

  • Repairing delicate printed circuit boards (PCBs) in mobile phones.

• Performance:

  • It offers excellent welding performance with even and fine solder beads.

  • The paste is fine, sticky, non-foaming, and leaves minimal residue (no-clean flux formula).

  • It boasts strong vitality and welding ability, helping reject false welding.
    

Package includes:

• 1 x Solder Paste