Relife RL-402  No-clean 183°C Soldering Paste for Phones BGA Reballing Soldering 

• 183°C Solder paste with high quality

• Solder wicking is strong

• Less residual

• No-clean

• Alloy Ratio: Sn63/Pb37

• Viscosity: 160 ~ 230Pa.s

• The size of granule: 20-38um

Package includes:

• 1 x Soldering Paste