2UUL 50g 138*/ 148* / 183*C / 199* Red Skull Solder Tin Paste for Repair
Key features
Melting Points: The Red Skull series is available in several melting points to suit different repair needs and component sensitivities:
138°C (low temp, for heat-sensitive components)
148°C (low temp)
183°C (moderate/eutectic point)
199°C (higher temp, for general soldering)
Applications: Ideal for BGA (Ball Grid Array) stencil reballing, SMD (Surface Mount Device) rework, and general motherboard repair. It is particularly suited for modern smartphones where low-temperature soldering is critical to prevent board warping.
Performance:
Strong conductivity and anti-oxidation properties ensure reliable, long-lasting connections.
Minimal residue after soldering, reducing the need for extensive post-solder cleaning ("no-clean formula").
Good wetting action for consistent, clean solder joints.
Not easy to crack and no false welding issues.
Packaging: Typically comes in a 50g container (tub or syringe-like) for controlled dispensing.
How to Use
Clean: Clean the PCB area to be worked on to ensure it is free of old solder, dust, or oil.
Apply: Apply a small, even amount of the solder paste onto the pads, often using a stencil for BGA work.
Heat: Heat the area using a hot air rework station or reflow oven until the paste melts at its specified temperature.
Cool: Allow the joint to cool naturally to form a solid connection.
