Sunshine SS-101F Chip Repair Advanced Blade Set for Separating Dot Matrix/Glue Removal/Chip Removal
Features:
Separation of dot matrix, glue removal from the bottom of the board, wire break assistance, removal of large chips
It is suitable for separating dot-matrix/board bottom glue removal/large chip removal/disconnection assistance, etc., to meet your maintenance needs
The blade is hardened, the cutting edge is ultra-thin, the slope on both sides is polished at the same time, and the blade is evenly stressed on both sides from thick to thin
Super toughness, better protection of mobile phone chips
Low center of gravity Is more stable, double-headed non-slip handle, low center of gravity more stable
With universal handle, high-quality material selection, and a strong guarantee of product quality
Mobile phone repair commonly used blades, hard disk removal, removal of mobile phone chips, motherboard CPU layering
