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Fonekong 138 183 Degree PPD Solder Paste For PCB BGA Reballing

FONEKONG 183°C PPD Solder Paste

  • Melting Point: 183°C.

  • Application: This is the standard, general-purpose solder paste for most BGA reballing, component soldering, and general high-precision SMT (Surface Mount Technology) work on PCBs. The 183°C melting point (eutectic, often Sn63/Pb37 alloy) ensures reliable, strong joints without requiring excessively high temperatures that could damage the board.

  • Key Features: Excellent wettability, strong adhesion, minimal residue ("no-clean formula"), bright and full solder joints, and increased silver particles for improved conductivity. 

FONEKONG 138°C PPD Solder Paste 

  • Melting Point: 138°C.

  • Application: This is a specialized low-temperature solder paste used for heat-sensitive components. Technicians use it when working on delicate parts like certain CPUs, power ICs, or microphones that can be easily damaged by the higher temperatures required for 183°C paste. It minimizes the risk of overheating and board warping.

  • Key Features: Ensures precise and efficient soldering while minimizing the risk of overheating sensitive components, fine and sticky texture, and prevents "tin bubbling".