FONEKONG 183 Degree Lead Solder Paste For PCB BGA Reballing

Description:

1.High resistance, strong vitality, and strong welding ability.

2.Excellent welding performance, tin beads are even and delicate, and welding is firm.

3.New silver-containing formula, higher specifications, to solve the pain points of mobile phone repair.

4.Increase the silver particles, greatly improve the conductivity, and reject the virtual soldering.

5.Fine and sticky, no tin bubbling, uniform solder balls and firm soldering.