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Mijing Z21 Max CPU Chip BGA Stencil Platform Set for iPhone A8-A16/Hisilicon/Qualcomm Snapdragon

Features:

  • Automatic precise positioning

  • The new magnetic dynamic original positioning

  • Strong magnetic force automatic clamping


Installation Method:

  • Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh)

  • Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip)


Package includes:

  • 1 x Tin planting platform set