2UUL BH11 Universal Phone Middle Reballing Magnetic Platform For Motherboard Repair

Key Features and Specifications

• Function: A universal platform for holding mobile phone motherboards and components securely during repairs, specifically for the middle layer tinning and BGA reballing processes.

• Material: Constructed from high-quality, durable materials, with some listings mentioning S2 Alloy Tool Steel for the platform.

• Magnetic Strength: Features robust magnetic strength to securely hold small components and steel stencils in place, minimizing the risk of misplaced parts.

• Heat Resistance: The platform is high-temperature resistant, allowing technicians to use a heat gun directly on it.

• Design: The platform groove has two depths (1mm and 2mm) to accommodate different thicknesses of mobile phone motherboards or chips.

• Compatibility: Designed as a universal tool compatible with a wide range of phone boards (both iPhone and Android devices).