Mechanic 2nd Magic Tag Rework Pad Dots Repairing Soldering Spot

Key features

• Replaces Jumper Wires: Eliminates the need for meticulously curling and routing fine jumper wires to bridge broken traces or pads, significantly increasing repair efficiency.

• Seamless Repair: The pads are ultra-thin (industrial-grade copper foil with a thickness of 30μm) and designed to "restore to the original pad without a trace" after being fixed with UV curing solder mask ink (green oil).

• Strong and Stable: The pads feature "fixed pins" that are reinforced to prevent them from falling off after installation. They provide a stable electrical connection and good welding strength.

• High Compatibility: The set includes various shapes and sizes of pads (round, rectangular, oval) to match different repair needs across various phone models (iPhone, Android, etc.).

• Easy to Use: Technicians can simply apply heat with a soldering iron or spot welder to attach the pad, then connect their required component or wire efficiently. 

Use cases

• Repairing damaged or missing BGA (Ball Grid Array) pads on ICs, CPUs, and NAND chips.

• Restoring connections on broken flex cables or battery terminals on a PCB.

• Allowing the direct recombination of double-layered motherboards after repair without the issues caused by traditional, bulky jumper wires.
  

Package includes:

1 x Mechanic Magic Tag