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Relife RL-404S 138°C Low-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA Repair

Key Features and Specifications

  • Low Melting Point: The main characteristic is its low melting point of 138°C, which minimizes heat stress and the risk of damage to sensitive components during the soldering process.

  • Lead-Free Formula: It is a lead-free and environmentally friendly paste (alloy composition Sn42/Bi58), meeting modern environmental standards and ensuring a safer working environment.

  • Applications: Ideal for SMT (Surface Mount Technology), BGA (Ball Grid Array) reballing/tin planting, chip-level repairs, and other delicate precision electronic assembly tasks.

  • High Performance Flux: The paste includes a no-clean flux formula that provides excellent wettability, strong conductivity, and anti-oxidation properties, resulting in bright, full, and reliable solder joints with minimal residue.

  • Convenient Packaging: It is typically sold in a syringe (e.g., 10cc volume) with included needles and a putter/plunger for precise application, reducing waste and mess.

  • Storage: The paste can be stored in a refrigerated environment (0–10°C) for up to 12 months without losing quality.

  • Particle Size: The fine, delicate particle size (20-38 μm) ensures uniform application, even when using ultra-fine pitch stencils