RELIFE RL-420S-UV Soldering Flux Paste For BGA PCB Repair

Key features

• UV reactive: A unique UV formula allows technicians to easily inspect for residue under UV light after soldering, ensuring a clean and efficient repair process.

• High-activity formula: Ensures superior solder wetting and flow, which creates stronger, more reliable solder joints while preventing issues like cold joints and bridging.

• Low-residue and no-clean: The paste leaves minimal, non-corrosive residue after soldering, which simplifies the cleaning process and protects sensitive components from damage.

• Safe and stable: It is formulated with halogen-free materials and offers excellent thermal stability, maintaining its effectiveness during high-temperature rework and protecting components from heat stress.

• Precise application: The flux is packaged in a syringe with a push rod and needle, allowing for easy and controlled application and reducing waste.

• Versatile use: It is suitable for a wide range of micro-soldering tasks, including:

  • BGA reballing and rework

  • Chip-level repair

  • SMD soldering

  • General mobile and laptop motherboard repair