RELIFE RL-421S Soldering Flux Paste For BGA PCB Repair

Key features

• High-viscosity formula: The paste's high viscosity ensures precise application and prevents it from spreading to unwanted areas, which is crucial for intricate, high-density PCBs found in mobile phones, tablets, and laptops.

• No-clean and low residue: It leaves behind minimal, non-corrosive residue after soldering, which often does not require cleaning. This reduces post-repair work and protects sensitive electronic components.

• Strong wetting and activity: Formulated with high-quality imported rosin, the flux provides strong activity to remove oxidation from component surfaces and pads. This promotes excellent solder wetting and flow, ensuring strong, reliable solder joints.

• Fast tinning with minimal smoke: The flux allows for quick and efficient tinning with minimal smoke, creating a safer and more comfortable working environment for the technician.

• High insulation resistance: This feature ensures that any remaining residue is non-conductive, which prevents short circuits and protects the repaired circuit board.

• Syringe packaging: The flux is typically sold in a 10cc syringe with a push rod and needle for easy, controlled, and precise dispensing. 

Typical applications

The Relife RL-421S-OR is a professional-grade flux used for: 

• BGA reballing and rework on CPUs and other IC chips

• Soldering and desoldering SMD components

• General PCB soldering and repair, particularly on mobile phones and computer motherboards.