Mijing iRepair MS1 Intelligent Universal Desoldering Platform for iPhone X-16 Pro Max


Key Features and Uses

• Motherboard Layering and Separation: Its primary function is the safe separation of layered PCBs found in modern iPhones (from X up to the latest 16 Pro Max models) without causing damage to surrounding components.

• Precise Temperature Control: The platform features accurate digital temperature control, allowing technicians to set specific heating profiles (range of 50°C to 300°C) tailored to the melting point of different solders (e.g., around 183°C for tin-lead).

• Modular Design: The MS1 is highly expandable and works with various specialized heating modules/molds.

• Safety Features:

  • Intelligent Sleep Function: The device often includes an intelligent 15-minute sleep function to conserve energy and enhance safety.

  • Countdown Function: Newly added countdown functions in updated versions help time the heating process accurately, reducing the risk of overheating sensitive boards.

  • Silica Gel Insulation: High-temperature resistant silicone insulation reduces heat transfer to the bottom of the unit, protecting the work surface.

• Efficient Heating: It uses high-quality heating elements for fast and stable heat transfer, ensuring rapid temperature rise (e.g., reaching 183°C in three minutes).

• Voltage Compatibility: It supports a dual-gear voltage shift (110V/220V) with a single button, making it suitable for international use.