Mechanic SD360 No-clean Flux Solder Paste for PCB SMD BGA Soldering Tools

Key Features

• Formula: It is a lead-free, halogen-free, no-clean flux formula that produces minimal, non-corrosive, and non-conductive residue after soldering, eliminating the need for post-solder cleaning.

• Performance: The flux improves heat transfer and ensures excellent wetting and stronger adhesion of the solder, which prevents issues like cold solder joints or oxidation.

• Safety and Environment: It produces low smoke and has a light odor during use, making it safer and more comfortable for use in enclosed workspaces.

• Application: It comes in a 10cc syringe with a push rod for precise application, minimizing waste and ensuring the correct amount is used for delicate work

Common applications:

The MECHANIC SD360 is widely used by technicians for:

BGA (Ball Grid Array) rework: It is effective for the reballing and soldering of BGA chips on motherboards.

SMD (Surface-Mount Device) components: Its precision and low-residue properties make it ideal for working with delicate SMD components.

CPU and IC repair: It is a staple for soldering and repairing CPUs and other integrated circuits in mobile phones, laptops, and other electronics.

General motherboard repair: It can be used for any general PCB soldering and repair task where a clean, strong bond is required.