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Relife RL-403S 183°C 10CC High-quality Solder Paste Flux

Key Features and Specifications

  • Melting Point: This solder paste is a medium-temperature solution, melting at 183°C.

  • Composition: It is a leaded solder paste with an alloy ratio of Sn63/Pb37 (63% Tin, 37% Lead).

  • Application: Ideal for BGA (Ball Grid Array) reballing, SMT (Surface Mount Technology) repairs, and general chip-level soldering on mobile phone motherboards.

  • Performance:

    • Wettability: Offers excellent wettability, maintaining a wet surface for up to 36 hours after opening.

    • Residue: It has a "no-clean" formula, leaving minimal residue after soldering.

    • Joint Quality: Provides strong soldering ability with bright, full, and reliable solder joints, and prevents issues like false welding.

  • Packaging: Comes in a convenient syringe-type packaging (typically 10cc or 10ml volume) with a push rod and needles of different specifications for precise application and minimal waste.

  • Particle Size: The paste consists of fine particles, 20-38 microns in size, which ensures uniform application.