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QU7 BGA Reballing Stencil for CPU SM4250 SM7150 SM6125 SM7225 SM7250 SM7350 SM7125 SM6115

Compatible ICs

The QU7 stencil is compatible with several specific Qualcomm CPUs, particularly those found in mid-range and budget smartphones. 

  • Snapdragon 460: SM4250

  • Snapdragon 662: SM6115

  • Snapdragon 665: SM6125

  • Snapdragon 720G: SM7125

  • Snapdragon 730G: SM7150

  • Snapdragon 750G: SM7225

  • Snapdragon 765G: SM7250

  • Snapdragon 775G: SM7350 

Key features

  • Material: It is typically made from high-quality, durable, and heat-resistant stainless steel.

  • Thickness: The stencil is usually 0.12mm thick, which is an optimal thickness for controlled solder paste application during the reballing process.

  • Reusability: The durable material and design make the stencil reusable for multiple repairs.

  • Precision: The laser-cut openings precisely match the pad layout of the compatible chips, ensuring a perfect fit and reducing the risk of misalignment or solder bridges.