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Mega Idea Universal Black Stencil 0.3 / 0.35 / 0.4 / 0.5 BGA Reballing Stencil for Mobile Phone BGA Chip Repair



Key features

  • Black surface: The black coating is designed to minimize light reflection, improving visibility and reducing eye strain during precise work under a microscope.

  • High precision: Crafted from premium stainless steel, it features high-precision apertures for accurate and uniform application of solder paste or solder balls.

  • Universal functionality: The stencil has multiple grids and patterns to support different solder ball sizes, such as 0.3mm, 0.35mm, 0.4mm, and 0.5mm, which are common in modern electronics.

  • Durability: The stencil is resistant to heat, warping, and corrosion, ensuring long-term use and reliability.

  • Compatibility: While "universal," the stencil is optimized for use with specific brands and types of chips. Popular variants include those for Qualcomm, MediaTek, and iPhone/Apple CPUs and ICs. 

Applications in mobile repair

  • BGA reballing: The primary purpose is to apply solder balls to a BGA chip after it has been removed from a motherboard. This is essential for reconnecting the chip properly.

  • Chipset repair: It is used for reballing CPUs and other chipsets from various phone models, restoring connectivity and function.

  • Component rework: Technicians use it for surface-mount device (SMD) assembly, allowing for the precise and uniform placement of solder paste before soldering.